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Semiconductor Lithography Equipment
FPA-6300ES6a
High Resolution / High Productivity KrF Scanner

  • Features
  • Specifications

Basic Information

Model Name: FPA-6300ES6a

Features

FPA-6300ES6a scanners deliver High-Productivity

Processing time was reduced by speeding up the exposure process with a new-design Reticle & Wafer Stages, by improving alignment sequences and wafer handling time reduction. The throughput of the FPA-6300ES6a is over *200 wph (wafers per hour) which is 1.6 times higher productivity than previous FPA-6000ES6a model scanners.

  • *300 mm (12 inch) wafer, 98 shots, with Options applied

FPA-6300ES6a scanners realize industry-leading Overlay Accuracy

To minimize overlay misalignment & intrafield distortion during exposure, advanced stage vibration & synchronous control technologies were adopted in the FPA-6300ES6a. The alignment scope was also improved in order to measure the alignment marks on a wafer more accurately.
Furthermore, by accurately controlling the temperature of the exposure area and the reticle area, **industry-leading Mix & Match overlay accuracy of ≤ 5nm has been realized.

  • **as of December 14, 2016 (Examination by Canon), with Options applied

FPA-6300ES6a scanners provide high-reliability

The FPA-6300ES6a platform provides substantial improvements in terms of base durability and maintenance requirements, as well as reduced install times and increased system uptime and availability when compared to earlier FPA-6000 Platform scanners. FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.

Specifications

Resolution
≦ 90 nm
NA (Numerical Aperture)
0.86~0.50 (Variable)
Reduction Ratio
1:4
Field Size
26 mm x 33 mm
Exposure Wavelength
KrF 248 nm
Reticle Size
6 inch
Wafer Size
200 mm (8 inch), 300 mm (12 inch) (Selection)
Overlay Accuracy
≦ *5 nm
Main Body Dimensions
(W) 2,300 x (D) 5,155 x (H) 2,900 mm
Major Options
Various Mix & Match Overlay Improvement Options
Various Throughput Improvement Options
Various CD Uniformity Improvement Options
Focus Accuracy Improvement Option (F-MAP)
Focus Spot Automatic Chuck Cleaning
Various Productivity Improvement Options
AFIS Illumination System
SMIF OHT Kit
PC Remote Console
Online Function (GEM2)
Pellicle Particle Checker
  • *= Options Required
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